A low voltage protection device that includes a silicon substrate comprises an inner layer of a first dopant type. The device also includes a first outer layer of a second dopant type disposed adjacent a first surface of the inner layer and a second outer layer of the second dopant type disposed adjacent a second surface of the inner layer opposite the first surface. The device further includes a first mesa region disposed in a peripheral region of a first side of the low voltage protection device. The first mesa region includes a first area that includes a peripheral portion of a cathode of the low voltage protection device, the cathode formed by diffusing a high concentration of dopant species of the first type on a first surface of the silicon substrate, and a second area comprising a high concentration of diffused dopant species of the second type.