发明授权
- 专利标题： Suspension board with circuit having an electrically conductive layer interposed between a support terminal and metal plating layer
- 专利标题（中）： 具有插入在支撑端子和金属电镀层之间的导电层的电路的悬挂板
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申请号： US13317599申请日： 2011-10-24
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公开(公告)号： US08547663B2公开(公告)日： 2013-10-01
- 发明人: Yuu Sugimoto
- 申请人： Yuu Sugimoto
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2010-251655 20101110
- 主分类号： G11B5/48
- IPC分类号： G11B5/48 ; H05K1/09
摘要：
A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.
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