Invention Grant
- Patent Title: Conductive pin attached to package substrate
- Patent Title (中): 导电针连接到封装衬底
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Application No.: US12546950Application Date: 2009-08-25
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Publication No.: US08536696B2Publication Date: 2013-09-17
- Inventor: Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
- Applicant: Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP10-357039 19981216; JP11-034616 19990104; JP11-097648 19990405; JP11-097649 19990405; JP11-097650 19990405; JP11-104294 19990412; JP11-231931 19990818; JP11-231932 19990818; JP11-231933 19990818; JP11-231934 19990818
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/00 ; H05K7/00
Abstract:
A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.
Public/Granted literature
- US20090314537A1 CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE Public/Granted day:2009-12-24
Information query
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