发明授权
- 专利标题： Method of manufacturing array substrate, array substrate, method of manufacturing screen, and screen
- 专利标题（中）： 阵列基板，阵列基板，屏幕制造方法和屏幕的制造方法
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申请号： US13449688申请日： 2012-04-18
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公开(公告)号： US08498050B2公开(公告)日： 2013-07-30
- 发明人: Atsushi Saito
- 申请人： Atsushi Saito
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： ALG Intellectual Property, LLC
- 优先权： JP2011-099237 20110427
- 主分类号： G03B21/56
- IPC分类号： G03B21/56
摘要：
A plurality of convex portions, or concave portions which is transferred in an array shape, and a groove are transferred with respect to the substrate having thermoplasticity by a mold member having shapes of the convex portion, or the concave portion, and a protruding portion as the groove, and substrate transfer processing is included, in which the convex portion, or concave portion, and a protruding portion which are formed in the mold member are transferred to the substrate by pressing the mold member to the substrate.
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