A semiconductor device (1) detecting damage to the peripheral part of a chip which could potentially grow into a defect includes: a wire (3) formed along the outer periphery of a semiconductor chip (2d) to detect damage; a detection circuit (4) provided in the semiconductor chip (2) to supply a detection signal to the wire (3) to detect a break in the wire (3); an output terminal (5) for outputting the detection signal having passed through the wire (3); an internal circuit (6) provided in the semiconductor chip (2); an output switching circuit (7) selecting either an output signal of the internal circuit (6) or the detection signal having passed the wire (3) for output to the output terminal (5); a heating element (15a) heating the peripheral part of the chip; a power supply circuit (16) supplying power to the heating element; and a temperature detection/control circuit (17) controlling the heating by the heating element. This configuration enables easy detection of damage to the chip by logic test without additional measurement terminals. The configuration also enables detection of chips which could develop a defect when packaged.