发明授权
US08497567B2 Thin-film capacitor, multilayer wiring board and semiconductor device
有权
薄膜电容器，多层布线板和半导体器件
- 专利标题： Thin-film capacitor, multilayer wiring board and semiconductor device
- 专利标题（中）： 薄膜电容器，多层布线板和半导体器件
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申请号： US13523301申请日： 2012-06-14
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公开(公告)号： US08497567B2公开(公告)日： 2013-07-30
- 发明人: Shinji Rokuhara
- 申请人： Shinji Rokuhara
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Dentons US LLP
- 优先权： JP2011-139836 20110623
- 主分类号： H01L27/08
- IPC分类号： H01L27/08
摘要：
A thin-film capacitor with first capacitative elements each having an electrode layer with a first polarity on an upper surface of a dielectric layer and an electrode layer with a second polarity on a lower surface of the dielectric layer; second capacitative elements each having an electrode layer with the second polarity on the upper surface and an electrode layer with the first polarity on the lower surface and arranged around a specific position alternately with the first capacitative elements; a single common connection hole at the specific position connecting all electrode layers with the first polarity of the first and second capacitative elements; and individual connection holes around the common connection hole connecting each electrode layer with the second polarity of the adjacent and second capacitative elements.
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