发明授权
- 专利标题： Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
- 专利标题（中）： 用于电子部件的引线框带和模具装置以及封装电子部件的方法
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申请号： US13612922申请日： 2012-09-13
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公开(公告)号： US08497158B2公开(公告)日： 2013-07-30
- 发明人: Jeffrey Khai Huat Low , Kean Cheong Lee
- 申请人： Jeffrey Khai Huat Low , Kean Cheong Lee
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
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