Invention Grant
- Patent Title: Silicon nitride cutting tool
- Patent Title (中): 氮化硅切削工具
-
Application No.: US12411186Application Date: 2009-03-25
-
Publication No.: US08496718B2Publication Date: 2013-07-30
- Inventor: Takashi Watanabe , Tatsuyuki Nakaoka , Takero Fukudome , Shuichi Tateno , Hiroshi Yoshimitsu
- Applicant: Takashi Watanabe , Tatsuyuki Nakaoka , Takero Fukudome , Shuichi Tateno , Hiroshi Yoshimitsu
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-080822 20080326
- Main IPC: C09K3/14
- IPC: C09K3/14
Abstract:
A silicon nitride cutting tool comprising a sintered product is disclosed. The sintered product comprises silicon nitride, at least one rare earth element compound, and a magnesium compound. The silicon nitride cutting tool further comprises a surface region and an inside region comprising the sintered product with varying content ratios of component compounds to provide enhanced wear and fracture resistance.
Public/Granted literature
- US20090246464A1 SILICON NITRIDE CUTTING TOOL Public/Granted day:2009-10-01
Information query
