发明授权
US08492907B2 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
有权
用于倒装芯片型半导体背表面的薄膜，用于半导体背表面的切割带集成薄膜，用于制造半导体器件的工艺和倒装芯片型半导体器件
- 专利标题： Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
- 专利标题（中）： 用于倒装芯片型半导体背表面的薄膜，用于半导体背表面的切割带集成薄膜，用于制造半导体器件的工艺和倒装芯片型半导体器件
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申请号： US13186000申请日： 2011-07-19
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公开(公告)号： US08492907B2公开(公告)日： 2013-07-23
- 发明人: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- 申请人： Naohide Takamoto , Goji Shiga , Fumiteru Asai
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JPP2010-163047 20100720
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50 ; B32B3/00
摘要：
The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film having a light transmittance at a wavelength of 532 nm or 1064 nm of 20% or less, and having a contrast between a marking part and a part other than the marking part after laser marking of 20% or more.
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