Invention Grant
- Patent Title: Microfins for cooling an ultramobile device
- Patent Title (中): 用于冷却超移动装置的微烯烃
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Application No.: US13189389Application Date: 2011-07-22
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Publication No.: US08482922B2Publication Date: 2013-07-09
- Inventor: Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
- Applicant: Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B21D53/02
Abstract:
The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
Public/Granted literature
- US20110277980A1 MICROFINS FOR COOLING AN ULTRAMOBILE DEVICE Public/Granted day:2011-11-17
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