Invention Grant
- Patent Title: Heat spreader with high heat flux and high thermal conductivity
- Patent Title (中): 散热器具有高热通量和高导热性
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Application No.: US12946788Application Date: 2010-11-15
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Publication No.: US08482921B2Publication Date: 2013-07-09
- Inventor: Qingjun Cai , Chung-Lung Chen , Chialun Tsai
- Applicant: Qingjun Cai , Chung-Lung Chen , Chialun Tsai
- Applicant Address: US CA Thousand Oaks
- Assignee: Teledyne Scientific & Imaging, LLC.
- Current Assignee: Teledyne Scientific & Imaging, LLC.
- Current Assignee Address: US CA Thousand Oaks
- Agency: Brooks Acordia IP Law, PC
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
Public/Granted literature
- US20110284188A1 HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY Public/Granted day:2011-11-24
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