Invention Grant
- Patent Title: Method of making semiconductor package with improved standoff
- Patent Title (中): 制造具有改进间隔的半导体封装的方法
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Application No.: US13004028Application Date: 2011-01-11
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Publication No.: US08481369B2Publication Date: 2013-07-09
- Inventor: Junhua Luo , Xingshou Pang , Jinzhong Yao
- Applicant: Junhua Luo , Xingshou Pang , Jinzhong Yao
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201010141754 20100204
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.
Public/Granted literature
- US20110189823A1 METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH IMPROVED STANDOFF Public/Granted day:2011-08-04
Information query
IPC分类:
