Invention Grant
- Patent Title: Multi-spot illumination for wafer inspection
- Patent Title (中): 多点照明用于晶圆检查
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Application No.: US13187375Application Date: 2011-07-20
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Publication No.: US08462329B2Publication Date: 2013-06-11
- Inventor: Guoheng Zhao , Azmi Kadkly
- Applicant: Guoheng Zhao , Azmi Kadkly
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01N21/94
- IPC: G01N21/94
Abstract:
Illumination subsystems for multi-spot wafer inspection are provided.
Public/Granted literature
- US20120026489A1 Multi-Spot Illumination for Wafer Inspection Public/Granted day:2012-02-02
Information query
