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US08450119B2 Magnetic tunnel junction patterning using Ta/TaN as hard mask 有权
磁隧道结图案使用Ta / TaN作为硬掩模

Magnetic tunnel junction patterning using Ta/TaN as hard mask
Abstract:
An MTJ MRAM cell is formed by using a reactive ion etch (RIE) to pattern an MTJ stack on which there has been formed a bilayer Ta/TaN hard mask. The hard mask is formed by patterning a masking layer that has been formed by depositing a layer of TaN over a layer of Ta on the MTJ stack. After the stack is patterned, the TaN layer serves at least two advantageous purposes: 1) it protects the Ta layer from oxidation during the etching of the stack and 2) it serves as a surface having excellent adhesion properties for a subsequently deposited dielectric layer.
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