Invention Grant
- Patent Title: Connector assembly and method of manufacture
- Patent Title (中): 连接器组件及制造方法
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Application No.: US12948977Application Date: 2010-11-18
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Publication No.: US08449339B2Publication Date: 2013-05-28
- Inventor: Shutesh Krishnan , Soon Wei Wang
- Applicant: Shutesh Krishnan , Soon Wei Wang
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Rennie William Dover
- Priority: MYP12010004311 20100915
- Main IPC: H01R9/24
- IPC: H01R9/24

Abstract:
A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.
Public/Granted literature
- US20120064781A1 CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE Public/Granted day:2012-03-15
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