发明授权
- 专利标题: Forming conductive couplings in medical electrical leads
- 专利标题(中): 在医疗电线中形成导电接头
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申请号: US12781181申请日: 2010-05-17
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公开(公告)号: US08442646B2公开(公告)日: 2013-05-14
- 发明人: Kevin R. Seifert , Gregory A. Boser , Jonathan A. Hughes , Michael R. Dollimer
- 申请人: Kevin R. Seifert , Gregory A. Boser , Jonathan A. Hughes , Michael R. Dollimer
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Reed A. Duthler
- 主分类号: A61N1/05
- IPC分类号: A61N1/05
摘要:
An inner surface of a coupling component sidewall forms first and second portions of a cavity of the coupling component. A conductive coupling between an electrode and a conductor of a medical electrical lead may be formed by inserting a segment of the conductor into the first portion of the cavity, crimping the sidewall of the coupling component around the inserted segment, inserting a segment of the electrode into the second portion of the cavity, and welding an edge of the sidewall to the inserted electrode segment. The edge of the sidewall may define a slot, extending between first and second portions of the cavity, or a hole extending through the sidewall. The electrode may be part of an electrode assembly, mounted around an inner insulation layer of the lead, and the conductor may be part of a conductor assembly extending between inner and outer insulation layers of the lead.
公开/授权文献
- US20110282420A1 FORMING CONDUCTIVE COUPLINGS IN MEDICAL ELECTRICAL LEADS 公开/授权日:2011-11-17
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