Invention Grant
- Patent Title: Electronic apparatus and printed wiring board
- Patent Title (中): 电子设备和印刷电路板
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Application No.: US13032546Application Date: 2011-02-22
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Publication No.: US08432702B2Publication Date: 2013-04-30
- Inventor: Kenji Hasegawa , Tsuyoshi Kozai , Terunari Kanou
- Applicant: Kenji Hasegawa , Tsuyoshi Kozai , Terunari Kanou
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2008-232390 20080910
- Main IPC: H05K5/02
- IPC: H05K5/02
Abstract:
According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.
Public/Granted literature
- US20110141707A1 ELECTRONIC APPARATUS AND PRINTED WIRING BOARD Public/Granted day:2011-06-16
Information query
