Invention Grant
- Patent Title: System for electrically connecting a pair of circuit boards using a pair of board connectors and an interconnector received in apertures of the circuit boards
- Patent Title (中): 用于使用一对板连接器和接收在电路板的孔中的互连器电连接一对电路板的系统
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Application No.: US13301833Application Date: 2011-11-22
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Publication No.: US08419441B1Publication Date: 2013-04-16
- Inventor: John N. Topolewski , Richard J. Hampo
- Applicant: John N. Topolewski , Richard J. Hampo
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Brooks Kushman P.C.
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A system for electrically connecting circuit boards includes a pair of board connectors configured to be electrically connected to respective circuit boards. Each of the board connectors includes a plurality of electrical conductors and a housing configured to enclose at least a portion of the electrical conductors. An interconnector includes a plurality of electrical conductors, each of which is configured to be electrically connected to a respective electrical conductor of the board connectors, thereby electrically connecting the circuit boards. An interconnector housing is configured to cooperate with the housings of the board conductors to at least partially enclose the electrical connections between the electrical conductors of the interconnector and the board connectors.
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