发明授权
US08411067B2 Capacitive touch sensor and fabrication method thereof and capacitive touch panel
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电容触摸传感器及其制造方法和电容式触摸屏
- 专利标题: Capacitive touch sensor and fabrication method thereof and capacitive touch panel
- 专利标题(中): 电容触摸传感器及其制造方法和电容式触摸屏
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申请号: US13015262申请日: 2011-01-27
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公开(公告)号: US08411067B2公开(公告)日: 2013-04-02
- 发明人: Hsiang-Wei Yin , Ming-Kung Wu , Kuo-Chang Su , Ping-Wen Huang
- 申请人: Hsiang-Wei Yin , Ming-Kung Wu , Kuo-Chang Su , Ping-Wen Huang
- 申请人地址: CN Dongguan Songshan Lake TW Taichung
- 专利权人: Wintek Technology (H.K) Ltd.,Wintek Corporation
- 当前专利权人: Wintek Technology (H.K) Ltd.,Wintek Corporation
- 当前专利权人地址: CN Dongguan Songshan Lake TW Taichung
- 代理机构: Muncy, Geissler, Olds & Lowe, PLLC
- 优先权: TW99103209A 20100203; TW99139942A 20101119
- 主分类号: G06F3/045
- IPC分类号: G06F3/045
摘要:
A capacitive touch sensor includes multiple first-axis traces, multiple second-axis traces, an insulation layer and multiple metal traces. Each first-axis trace includes multiple first touch-sensing pads and first connecting lines connected therebetween. Each second-axis trace includes multiple second touch-sensing pads and second connecting lines connected therebetween. At least one of the first connecting line and the second connecting line is a metal printing line.
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