Invention Grant
- Patent Title: Multilayer structures for magnetic shielding
- Patent Title (中): 用于磁屏蔽的多层结构
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Application No.: US12861442Application Date: 2010-08-23
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Publication No.: US08399964B2Publication Date: 2013-03-19
- Inventor: Romney R. Katti
- Applicant: Romney R. Katti
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L23/552
- IPC: H01L23/552

Abstract:
A magnetic shield is presented. The shield may be used to protect a microelectronic device from stray magnetic fields. The shield includes at least two layers. A first layer includes a magnetic material that may be used to block DC magnetic fields. A second layer includes a conductive material that may be used to block AC magnetic fields. Depending on the type of material that the first and second layers include, a third layer may be inserted in between the first and second layers. The third layer may include a non-conductive material that may be used to ensure that separate eddy current regions form in the first and second layers.
Public/Granted literature
- US20110316129A1 MULTILAYER STRUCTURES FOR MAGNETIC SHIELDING Public/Granted day:2011-12-29
Information query
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