Invention Grant
US08390074B2 Structure and method for latchup improvement using through wafer via latchup guard ring
有权
用于通过闭锁保护环通过晶片的闩锁改进的结构和方法
- Patent Title: Structure and method for latchup improvement using through wafer via latchup guard ring
- Patent Title (中): 用于通过闭锁保护环通过晶片的闩锁改进的结构和方法
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Application No.: US13150437Application Date: 2011-06-01
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Publication No.: US08390074B2Publication Date: 2013-03-05
- Inventor: Steven H. Voldman
- Applicant: Steven H. Voldman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/119
Abstract:
A structure for preventing latchup. The structure includes a latchup sensitive structure and a through wafer via structure bounding the latch-up sensitive structure to prevent parasitic carriers from being injected into the latch-up sensitive structure.
Public/Granted literature
- US20110227166A1 STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VIA LATCHUP GUARD RING Public/Granted day:2011-09-22
Information query
IPC分类:
