Invention Grant
- Patent Title: Method for manufacturing porous microstructures, porous microstructures manufactured according to this method, and the use thereof
- Patent Title (中): 用于制造多孔微结构的方法，根据该方法制造的多孔微结构及其用途
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Application No.: US12810973Application Date: 2008-11-19
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Publication No.: US08377315B2Publication Date: 2013-02-19
- Inventor: Dick Scholten , Tjalf Pirk , Michael Stumber , Franz Laermer , Ralf Reichenbach , Ando Feyh
- Applicant: Dick Scholten , Tjalf Pirk , Michael Stumber , Franz Laermer , Ralf Reichenbach , Ando Feyh
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102008003453 20080108
- International Application: PCT/EP2008/065806 WO 20081119
- International Announcement: WO2009/086986 WO 20090716
- Main IPC: C23F1/00
- IPC: C23F1/00
Abstract:
A method for manufacturing porous microstructures in a silicon semiconductor substrate, porous microstructures manufactured according to this method, and the use thereof.
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