Invention Grant
US08371497B2 Method for manufacturing tight pitch, flip chip integrated circuit packages
有权
制造紧密间距，倒装芯片集成电路封装的方法
- Patent Title: Method for manufacturing tight pitch, flip chip integrated circuit packages
- Patent Title (中): 制造紧密间距，倒装芯片集成电路封装的方法
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Application No.: US12482668Application Date: 2009-06-11
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Publication No.: US08371497B2Publication Date: 2013-02-12
- Inventor: Christopher James Healy
- Applicant: Christopher James Healy
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo; Nicholas J. Pauley; Jonathan T. Velasco
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K35/34 ; B23K101/40
Abstract:
A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
Public/Granted literature
- US20100314433A1 Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit Packages Public/Granted day:2010-12-16
Information query
IPC分类:
