Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12309245Application Date: 2007-07-12
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Publication No.: US08362567B2Publication Date: 2013-01-29
- Inventor: Tadahiro Ohmi , Akinobu Teramoto , Rihito Kuroda
- Applicant: Tadahiro Ohmi , Akinobu Teramoto , Rihito Kuroda
- Applicant Address: JP Sendai-shi JP Tsukuba-shi
- Assignee: National University Corporation Tohoku University,Foundation for Advancement of International Science
- Current Assignee: National University Corporation Tohoku University,Foundation for Advancement of International Science
- Current Assignee Address: JP Sendai-shi JP Tsukuba-shi
- Agency: Foley & Lardner LLP
- Priority: JP2006-192440 20060713
- International Application: PCT/JP2007/063926 WO 20070712
- International Announcement: WO2008/007748 WO 20080117
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
In a semiconductor device, the degree of flatness of 0.3 nm or less in terms of a peak-to-valley (P-V) value is realized by rinsing a silicon surface with hydrogen-added ultrapure water in a light-screened state and in a nitrogen atmosphere and a contact resistance of 10−11 Ωcm2 or less is realized by setting a work function difference of 0.2 eV or less between an electrode and the silicon. Thus, the semiconductor device can operate on a frequency of 10 GHz or higher.
Public/Granted literature
- US20100059830A1 Semiconductor device Public/Granted day:2010-03-11
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