Invention Grant
- Patent Title: Multiple-beam system for high-speed electron-beam inspection
- Patent Title (中): 用于高速电子束检测的多光束系统
-
Application No.: US13095585Application Date: 2011-04-27
-
Publication No.: US08362425B2Publication Date: 2013-01-29
- Inventor: Liqun Han , Xinrong Jiang , John D. Greene
- Applicant: Liqun Han , Xinrong Jiang , John D. Greene
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Okamoto & Benedicto LLP
- Main IPC: G01N23/04
- IPC: G01N23/04 ; G01N23/00

Abstract:
One embodiment disclosed relates to a multiple-beamlet electron beam imaging apparatus for imaging a surface of a target substrate. A beam splitter lens array is configured to split the illumination beam to form a primary beamlet array, and a scanning system is configured to scan the primary beamlet array over an area of the surface of the target substrate. In addition, a detection system configured to detect individual secondary electron beamlets. Another embodiment disclosed relates to a method of imaging a surface of a target substrate using a multiple-beamlet electron beam column. Other features and embodiments are also disclosed.
Public/Granted literature
- US20120241606A1 MULTIPLE-BEAM SYSTEM FOR HIGH-SPEED ELECTRON-BEAM INSPECTION Public/Granted day:2012-09-27
Information query