Invention Grant
- Patent Title: Method and apparatus for an improved filled via
- Patent Title (中): 改进填充通孔的方法和装置
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Application No.: US12729511Application Date: 2010-03-23
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Publication No.: US08362368B2Publication Date: 2013-01-29
- Inventor: Michael Casper , Craig Hare , Adam Cook
- Applicant: Michael Casper , Craig Hare , Adam Cook
- Applicant Address: US NH Hollis
- Assignee: Ultrasource, Inc.
- Current Assignee: Ultrasource, Inc.
- Current Assignee Address: US NH Hollis
- Agency: Hayes Soloway P.C.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/36
Abstract:
The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.
Public/Granted literature
- US20100270062A1 Method and Apparatus for an Improved Filled Via Public/Granted day:2010-10-28
Information query
