发明授权
- 专利标题： Substrate treatment apparatus
- 专利标题（中）： 基板处理装置
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申请号： US12608662申请日： 2009-10-29
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公开(公告)号： US08361234B2公开(公告)日： 2013-01-29
- 发明人: Takashi Izuta , Hiroaki Ishii , Asuka Yoshizumi
- 申请人： Takashi Izuta , Hiroaki Ishii , Asuka Yoshizumi
- 申请人地址： JP
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Ostrolenk Faber LLP
- 优先权： JP2008-278568 20081029; JP2009-82614 20090330
- 主分类号： C23C16/44
- IPC分类号： C23C16/44
摘要：
A substrate treatment apparatus includes a substrate holding unit, a gas ejection nozzle, and a gas supply unit. The substrate holding unit is configured to hold a substrate. The gas supply unit is configured to supply a gas to the gas ejection nozzle. The gas ejection nozzle is disposed to be positioned adjacent a center portion of the substrate held by the substrate holding unit. The gas ejection nozzle has a gas ejection port. The gas ejection nozzle is configured to eject the gas radially from the gas ejection port over the substrate held by the substrate holding unit to form a gas-flow for covering the substrate.
公开/授权文献
- US20100101497A1 SUBSTRATE TREATMENT APPARATUS 公开/授权日：2010-04-29
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