发明授权
- 专利标题： Wiring board and liquid jetting head
- 专利标题（中）： 接线板和液体喷头
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申请号： US13040889申请日： 2011-03-04
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公开(公告)号： US08360556B2公开(公告)日： 2013-01-29
- 发明人: Yusuke Suzuki , Atsushi Ito
- 申请人： Yusuke Suzuki , Atsushi Ito
- 申请人地址： JP Aichi-Ken
- 专利权人： Brother Kogyo Kabushiki Kaisha
- 当前专利权人： Brother Kogyo Kabushiki Kaisha
- 当前专利权人地址： JP Aichi-Ken
- 代理机构： Frommer Lawrence & Haug LLP
- 优先权： JP2010-080659 20100331
- 主分类号： B41J2/14
- IPC分类号： B41J2/14
摘要：
A wiring board to be connected to an object includes: contact points to be connected to the object; wires connected to the contact points; and a substrate on which the contact points and the wires are formed. The substrate has a first portion which has openings and overlaps with the object when the wiring board is connected to the object, and a second portion which is continuous to the first portion. The contact points include first contact points formed in the first portion on one surface of the substrate facing the object, and second contact points formed in the second portion, on the other surface of the substrate, at areas which do not overlap with the first contact points when the substrate is bent so that the first portion is overlapped with the second portion.
公开/授权文献
- US20110240762A1 WIRING BOARD AND LIQUID JETTING HEAD 公开/授权日：2011-10-06
信息查询
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