发明授权
- 专利标题: Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate
- 专利标题(中): 电介质基板与介质基板中具有扼流结构的波导基板之间的波导连接
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申请号: US12671627申请日: 2008-07-31
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公开(公告)号: US08358185B2公开(公告)日: 2013-01-22
- 发明人: Kazuto Ohno , Takuya Suzuki , Shigeo Udagawa
- 申请人: Kazuto Ohno , Takuya Suzuki , Shigeo Udagawa
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-202272 20070802
- 国际申请: PCT/JP2008/063792 WO 20080731
- 国际公布: WO2009/017203 WO 20090205
- 主分类号: H01P1/04
- IPC分类号: H01P1/04 ; H01P5/02
摘要:
A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.
公开/授权文献
- US20110187482A1 WAVEGUIDE CONNECTION STRUCTURE 公开/授权日:2011-08-04
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