发明授权
- 专利标题： Humidity-reactive hotmelt adhesive with increased open time
- 专利标题（中）： 湿热反应热熔胶具有增加的开放时间
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申请号： US12226351申请日： 2007-06-29
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公开(公告)号： US08357453B2公开(公告)日： 2013-01-22
- 发明人: Ukiwo Onuoha
- 申请人： Ukiwo Onuoha
- 申请人地址： CH Baar
- 专利权人： Sika Technology AG
- 当前专利权人： Sika Technology AG
- 当前专利权人地址： CH Baar
- 代理机构： Oliff & Berridge, PLC
- 优先权： EP06116413 20060630
- 国际申请： PCT/EP2007/056600 WO 20070629
- 国际公布： WO2008/000832 WO 20080103
- 主分类号： B32B27/40
- IPC分类号： B32B27/40 ; C08L75/04 ; C09D175/04
摘要：
The invention relates to moisture-reactive hotmelt adhesive compositions which comprise at least one polyurethane prepolymer P1 being liquid at room temperature containing isocyanate groups and also at least one linear polyurethane P2 being solid at room temperature which comprises polycaprolactone segments, contains hydroxyl groups and has a melt viscosity of 100-300 Pa·s at 170° C. The compositions are notable in particular for a prolonged open time.
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