Invention Grant
- Patent Title: Multi-layer diffusion medium substrate
- Patent Title (中): 多层扩散介质基板
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Application No.: US11180423Application Date: 2005-07-13
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Publication No.: US08354199B2Publication Date: 2013-01-15
- Inventor: Chunxin Ji , Mark Mathias , Jeanette E. O'Hara , Yeh-Hung Lai
- Applicant: Chunxin Ji , Mark Mathias , Jeanette E. O'Hara , Yeh-Hung Lai
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: BrooksGroup
- Main IPC: H01M8/10
- IPC: H01M8/10 ; H01M8/24 ; H01M8/04 ; H01M4/64

Abstract:
A multi-layer diffusion medium substrate having improved mechanical properties is disclosed. The diffusion medium substrate includes at least one stiff layer and at least one compressible layer. The at least one stiff layer has a greater stiffness in the x-y direction as compared to the at least one compressible layer. The at least one compressible layer has a greater compressibility in the z direction. A method of fabricating a multi-layer diffusion medium substrate is also disclosed.
Public/Granted literature
- US20070015042A1 Multi-layer diffusion medium substrate Public/Granted day:2007-01-18
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