Invention Grant
- Patent Title: Top bond pad for transducing head interconnect
- Patent Title (中): 用于转换头互连的顶部接合垫
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Application No.: US13046242Application Date: 2011-03-11
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Publication No.: US08351158B2Publication Date: 2013-01-08
- Inventor: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- Applicant: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Fredrikson & Byron, PA
- Main IPC: G11B5/60
- IPC: G11B5/60

Abstract:
A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.
Public/Granted literature
- US20110157750A1 TOP BOND PAD FOR TRANSDUCING HEAD INTERCONNECT Public/Granted day:2011-06-30
Information query
IPC分类: