Invention Grant
- Patent Title: Conductive composition
- Patent Title (中): 导电组成
-
Application No.: US12512976Application Date: 2009-07-30
-
Publication No.: US08344523B2Publication Date: 2013-01-01
- Inventor: Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
- Applicant: Raymond L. Dietz , Maciej Patelka , Akito Yoshii , Pawel Czubarow , Takashi Sakamoto , Yukinari Abe
- Applicant Address: US MA Byfield
- Assignee: Diemat, Inc.
- Current Assignee: Diemat, Inc.
- Current Assignee Address: US MA Byfield
- Agency: Holtz Holtz Goodman & Chick, P.C.
- Main IPC: H01B1/22
- IPC: H01B1/22

Abstract:
Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (
Public/Granted literature
- US20100065790A1 Conductive Composition Public/Granted day:2010-03-18
Information query