Invention Grant
- Patent Title: Light-emitting element and the manufacturing method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US13106310Application Date: 2011-05-12
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Publication No.: US08344392B2Publication Date: 2013-01-01
- Inventor: Jui Hung Yeh , Chun Kai Wang , Wei Yu Yen , Yu Yao Lin , Chien Fu Shen , De Shan Kuo , Ting Chia Ko
- Applicant: Jui Hung Yeh , Chun Kai Wang , Wei Yu Yen , Yu Yao Lin , Chien Fu Shen , De Shan Kuo , Ting Chia Ko
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
A light-emitting element includes a light-emitting stack includes: a first semiconductor layer; an active layer formed on the first semiconductor layer; and a second semiconductor layer formed on the active layer; a recess structure formed through the second semiconductor layer, the active layer, and extended in the first semiconductor layer, wherein the first semiconductor layer includes a contact region defined by the recess structure; a first electrode structure including a first contact portion on the contact region of the first semiconductor layer, and a second contact portion laterally extended from the first contact portion into the first semiconductor layer; and a dielectric layer formed on side surfaces of the second semiconductor layer and the active layer to insulate the second semiconductor layer and the active layer from the first contact portion.
Public/Granted literature
- US20120286317A1 LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF Public/Granted day:2012-11-15
Information query
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