发明授权
- 专利标题: Methods of manufacturing capacitor structures and methods of manufacturing semiconductor devices using the same
- 专利标题(中): 制造电容器结构的方法和使用其制造半导体器件的方法
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申请号: US12659769申请日: 2010-03-19
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公开(公告)号: US08343845B2公开(公告)日: 2013-01-01
- 发明人: Yong-Il Kim , Dae-Ik Kim , Yun-Sung Lee , Nam-Jung Kang
- 申请人: Yong-Il Kim , Dae-Ik Kim , Yun-Sung Lee , Nam-Jung Kang
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2009-0023929 20090320
- 主分类号: H01L21/30
- IPC分类号: H01L21/30
摘要:
A capacitor structure includes a plurality of lower electrodes on a substrate, the lower electrodes having planar top surfaces and being arranged in a first direction to define a lower electrode column, a plurality of lower electrode columns being arranged in a second direction perpendicular to the first direction to define a lower electrode matrix, a plurality of supports on upper sidewalls of at least two adjacent lower electrodes, a dielectric layer on the lower electrodes and the supports, and an upper electrode on the dielectric layer.
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