Invention Grant
- Patent Title: Droplet ejection device
- Patent Title (中): 滴液喷射装置
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Application No.: US12719026Application Date: 2010-03-08
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Publication No.: US08336997B2Publication Date: 2012-12-25
- Inventor: Masahito Katada
- Applicant: Masahito Katada , Yuko Katada, legal representative , Natsuki Katada, legal representative , Daichi Katada, legal representative
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2009-074920 20090325
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A droplet ejection device includes a liquid ejection head, a supply flow path, a supply pump, and a supply flow path pressurizer. The supply flow path supplies the liquid to the head and for which a first depressurization threshold is specified in advance. The supply pump sucks the liquid, pressurizes the sucked liquid and supplies the sucked liquid to the head via the supply flow path, and keeps a pressure of liquid in the supply flow path near to a predetermined supply flow path target pressure. The supply flow path pressurizer pressurizes the pressure of liquid in the supply flow path if the pressure of liquid in the supply flow path falls to less than or equal to the first depressurization threshold.
Public/Granted literature
- US20100245495A1 DROPLET EJECTION DEVICE Public/Granted day:2010-09-30
Information query
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