发明授权
US08336204B2 Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
有权
通过扩散阻挡层和种子层的反应形成合金衬里，用于互连应用
- 专利标题： Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
- 专利标题（中）： 通过扩散阻挡层和种子层的反应形成合金衬里，用于互连应用
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申请号： US12509885申请日： 2009-07-27
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公开(公告)号： US08336204B2公开(公告)日： 2012-12-25
- 发明人: Chih-Chao Yang , Daniel C. Edelstein , Takeshi Nogami
- 申请人： Chih-Chao Yang , Daniel C. Edelstein , Takeshi Nogami
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Katherine S. Brown, Esq.
- 主分类号： H01K3/10
- IPC分类号： H01K3/10
摘要：
An interconnect structure including an alloy liner positioned directly between a diffusion barrier and a Cu alloy seed layer as well as methods for forming such an interconnect structure are provided. The alloy liner of the present invention is formed by thermally reacting a previously deposited diffusion barrier metal alloy layer with an overlying Cu alloy seed layer. During the thermal reaction, the metal alloys from both the diffusion barrier and the Cu alloys seed layer react forming a metal alloy reaction product between the diffusion barrier and the Cu seed layer.
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