Invention Grant
- Patent Title: Tool for installation and removal of semiconductor device
- Patent Title (中): 用于安装和拆卸半导体器件的工具
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Application No.: US12728096Application Date: 2010-03-19
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Publication No.: US08336199B2Publication Date: 2012-12-25
- Inventor: Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
- Applicant: Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, PC
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
Public/Granted literature
- US20110225819A1 PROCESSOR INSTALLATION AND REMOVAL TOOL Public/Granted day:2011-09-22
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