发明授权
- 专利标题: Electronic component mounting apparatus
- 专利标题(中): 电子元件安装装置
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申请号: US12727349申请日: 2010-03-19
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公开(公告)号: US08336195B2公开(公告)日: 2012-12-25
- 发明人: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama , Kazuyoshi Ieizumi
- 申请人: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama , Kazuyoshi Ieizumi
- 申请人地址: JP Gunma
- 专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人地址: JP Gunma
- 代理机构: Morrison & Foerster LLP
- 优先权: JP2005-345114 20051130
- 主分类号: B23P19/00
- IPC分类号: B23P19/00
摘要:
The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.
公开/授权文献
- US20100186223A1 ELECTRONIC COMPONENT MOUNTING APPARATUS 公开/授权日:2010-07-29
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