A method of packaging a semiconductor device may include providing a semiconductor substrate including first and second spaced apart semiconductor chip areas, and adhering a cover on the first and second spaced apart semiconductor chip areas of the semiconductor substrate. A scribe line may be formed through the semiconductor substrate between the first and second semiconductor chip areas with a semiconductor bridge pattern remaining connected between the first and second spaced apart semiconductor chip areas after forming the scribe line. The cover and the semiconductor bridge pattern may then be cut after forming the scribe line.