A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a base to support the mount. The base further includes a dispenser portion. The polishing apparatus further includes a polishing strip dispensable by the dispensing portion of the base. The polishing strip has a portion thereof extending through a passageway formed in the mount, where a first surface of the polishing strip is disposed proximate to an end face of the ferrule of the optical connector disposed in the mount. In an exemplary aspect, the polishing strip comprises one or more polishing media disposed on a backing material.