Invention Grant
- Patent Title: Upstream channel bonding in a cable communications system
- Patent Title (中): 电缆通信系统中的上行信道绑定
-
Application No.: US11298446Application Date: 2005-12-12
-
Publication No.: US08279892B2Publication Date: 2012-10-02
- Inventor: Lisa Voigt Denney , Niki Roberta Pantelias , A. Scott Hollums , Victor T. Hou , John Daniel Horton, Jr. , David Michael Pullen
- Applicant: Lisa Voigt Denney , Niki Roberta Pantelias , A. Scott Hollums , Victor T. Hou , John Daniel Horton, Jr. , David Michael Pullen
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox PLLC
- Main IPC: H04J3/16
- IPC: H04J3/16
Abstract:
A method for increasing upstream bandwidth per cable modem user in a cable communications system that includes a cable modem termination system (CMTS) and a plurality of cable modems is provided. The method permits a cable modem to transmit data to the CMTS on multiple upstream channels simultaneously using a technique called “channel bonding.” Channel bonding allows smaller bandwidth upstream channels to be bonded together to create a larger bandwidth pipe.
Public/Granted literature
- US20060126660A1 Upstream channel bonding in a cable communications system Public/Granted day:2006-06-15
Information query
