发明授权
- 专利标题： Micromechanical structure and a method of fabricating a micromechanical structure
- 专利标题（中）： 微机械结构和微机械结构的制造方法
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申请号： US12514304申请日： 2007-11-09
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公开(公告)号： US08278725B2公开(公告)日： 2012-10-02
- 发明人: Sudhiranjan Tripathy , Vicknesh s/o Sahmuganathan
- 申请人： Sudhiranjan Tripathy , Vicknesh s/o Sahmuganathan
- 申请人地址： SG Connexis
- 专利权人： Agency for Science, Technology and Research
- 当前专利权人： Agency for Science, Technology and Research
- 当前专利权人地址： SG Connexis
- 代理机构： Morrision & Foerster LLP
- 国际申请： PCT/SG2007/000386 WO 20071109
- 国际公布： WO2008/057055 WO 20080515
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L29/04
摘要：
A micromechanical structure and a method of fabricating a micromechanical structure are provided. The micromechanical structure comprises a silicon (Si) based substrate; a micromechanical element formed directly on the substrate; and an undercut formed underneath a released portion of the micromechanical element; wherein the undercut is in the form of a recess formed in the Si based substrate.
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