发明授权
- 专利标题： LED device with embedded top electrode
- 专利标题（中）： 带嵌入式顶部电极的LED器件
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申请号： US12235269申请日： 2008-09-22
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公开(公告)号： US08278679B2公开(公告)日： 2012-10-02
- 发明人: Chen-Hua Yu , Ding-Yuan Chen , Wen-Chih Chiou
- 申请人： Chen-Hua Yu , Ding-Yuan Chen , Wen-Chih Chiou
- 申请人地址： TW Hsin-Chu
- 专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An LED device and a method of manufacturing, including an embedded top electrode, are presented. The LED device includes an LED structure and a top electrode. The LED structure includes layers disposed on a substrate, including an active light-emitting region. A top layer of the LED structure is a top contact layer. The top electrode is embedded into the top contact layer, wherein the top electrode electrically contacts the top contact layer.
公开/授权文献
- US20090267105A1 LED Device with Embedded Top Electrode 公开/授权日：2009-10-29
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