Invention Grant
- Patent Title: Device and method for cutting off substrate of fragile material
- Patent Title (中): 用于切断脆性材料的基材的装置和方法
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Application No.: US11915894Application Date: 2006-05-26
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Publication No.: US08276796B2Publication Date: 2012-10-02
- Inventor: Yuki Nishisaka , Kenji Otoda , Shuichi Inoue , Toru Kumagai
- Applicant: Yuki Nishisaka , Kenji Otoda , Shuichi Inoue , Toru Kumagai
- Applicant Address: JP Osaka
- Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Snell & Wilmer L.L.P.
- Priority: JP2005-187324 20050530
- International Application: PCT/JP2006/310541 WO 20060526
- International Announcement: WO2006/129563 WO 20061207
- Main IPC: B26F1/20
- IPC: B26F1/20
Abstract:
A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.
Public/Granted literature
- US20100065599A1 DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL Public/Granted day:2010-03-18
Information query
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