Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US12674694Application Date: 2009-02-18
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Publication No.: US08274797B2Publication Date: 2012-09-25
- Inventor: Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- Applicant: Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2008-173383 20080702
- International Application: PCT/JP2009/000670 WO 20090218
- International Announcement: WO2010/001505 WO 20100107
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
Public/Granted literature
- US20110044017A1 ELECTRONIC COMPONENT Public/Granted day:2011-02-24
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