发明授权
- 专利标题： Electronic component
- 专利标题（中）： 电子元器件
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申请号： US12674694申请日： 2009-02-18
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公开(公告)号： US08274797B2公开(公告)日： 2012-09-25
- 发明人: Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- 申请人： Kazuyuki Ono , Yoshio Tanaka , Kiyoshi Nakajima , Naoto Kuratani , Tomofumi Maekawa
- 申请人地址： JP Kyoto
- 专利权人： OMRON Corporation
- 当前专利权人： OMRON Corporation
- 当前专利权人地址： JP Kyoto
- 代理机构： Osha Liang LLP
- 优先权： JP2008-173383 20080702
- 国际申请： PCT/JP2009/000670 WO 20090218
- 国际公布： WO2010/001505 WO 20100107
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
公开/授权文献
- US20110044017A1 ELECTRONIC COMPONENT 公开/授权日：2011-02-24
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