发明授权
- 专利标题： Heatsink mounting system
- 专利标题（中）： 散热片安装系统
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申请号： US12870605申请日： 2010-08-27
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公开(公告)号： US08274793B2公开(公告)日： 2012-09-25
- 发明人: Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
- 申请人： Fang Wang , Thierry Sin Yan Too , Jim Moore , Mong Hu
- 申请人地址： US CA Santa Clara
- 专利权人： Intricast Company, Inc.
- 当前专利权人： Intricast Company, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理商 Michael J. Hughes
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
公开/授权文献
- US20100321894A1 HEATSINK MOUNTING SYSTEM 公开/授权日：2010-12-23
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