- 专利标题: Electronic component, mounting structure thereof, and method for mounting electronic component
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申请号: US13329791申请日: 2011-12-19
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公开(公告)号: US08274201B2公开(公告)日: 2012-09-25
- 发明人: Nobuaki Hashimoto
- 申请人: Nobuaki Hashimoto
- 申请人地址: JP
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JP2007-272532 20071019; JP2008-036715 20080218
- 主分类号: H01L41/08
- IPC分类号: H01L41/08
摘要:
An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.
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