发明授权
- 专利标题: DRAM layout with vertical FETs and method of formation
- 专利标题(中): 具有垂直FET的DRAM布局和形成方法
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申请号: US13170050申请日: 2011-06-27
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公开(公告)号: US08274106B2公开(公告)日: 2012-09-25
- 发明人: Todd R. Abbott , H. Montgomery Manning
- 申请人: Todd R. Abbott , H. Montgomery Manning
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John, P.S.
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
DRAM cell arrays having a cell area of about 4F2 comprise an array of vertical transistors with buried bit lines and vertical double gate electrodes. The buried bit lines comprise a silicide material and are provided below a surface of the substrate. The word lines are optionally formed of a silicide material and form the gate electrode of the vertical transistors. The vertical transistor may comprise sequentially formed doped polysilicon layers or doped epitaxial layers. At least one of the buried bit lines is orthogonal to at least one of the vertical gate electrodes of the vertical transistors.
公开/授权文献
- US20110254067A1 DRAM Layout with Vertical FETS and Method of Formation 公开/授权日:2011-10-20
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